Electrospun Poly(ɛ-Caprolactone) Scaffold for Suture-Free Solder-Mediated Laser-Assisted Vessel Repair

Dara R. Pabittei, Michal Heger, Ron Balm, Han E. H. Meijer, Bas de Mol, Johan F. Beek

Research output: Contribution to journalArticleAcademicpeer-review

10 Citations (Scopus)

Abstract

Abstract Background and Objective: The addition of poly(lactic-co-glycolic) acid (PLGA) scaffolds to liquid solder-mediated laser-assisted vascular repair (sLAVR) has been shown to increase soldering strength significantly. Unfortunately, the fast degradation of PLGA is associated with adverse effects such as acidity of the degradation products. This study investigated the possibility of using electrospun poly(ɛ-caprolactone) (PCL) as reinforcement material in scaffold and solder-mediated LAVR (ssLAVR). Materials and Methods: In vitro sLAVR of 10-mm arteriotomies (n = 62) was performed on 0.3- to 0.6-cm diameter porcine carotid arteries with a 670-nm diode laser. The solder contained 50% bovine serum albumin (BSA) and 0.1-0.7% methylene blue (MB) as a chromophore. The soldering strength was studied as a function of PCL-scaffold thickness, scaffold-fiber diameter, MB concentration, number of laser passes, and different sLAVR techniques. Leaking-point pressures (LPPs) were measured with a fluid-infusion technique. Results: The highest mean ± SD LPP (749 ± 171 mm Hg) was produced by the ssLAVR modality that included the sheathing of the arteriotomy with 30 μL solder containing 50% BSA and 0.5% MB, followed by application of the PCL scaffold (mean ± SD thickness of 187 ± 9 μm and 14-μm fiber diameter) and irradiation with two consecutive continuous-wave laser passes. Conclusions: The study demonstrated the potential applicability of an electrospun PCL scaffold as reinforcement material in ssLAVR. Soldering strength was dependent on the scaffold physical properties, chromophore concentration, the number of laser passes, and the ssLAVR technique
Original languageEnglish
Pages (from-to)19-25
JournalPhotomedicine and Laser Surgery
Volume29
Issue number1
DOIs
Publication statusPublished - 2011

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