Fast and Robust Overlay Metrology from Visible to Infrared Wavelengths Using Dark-field Digital Holographic Microscopy

C. Messinis; T. T.M. Van Schaijk; N. Pandey; V. T. Tenner; A. Koolen; S. Witte; J. F. De Boer; A. J. Den Boef

doi:https://doi.org/10.1117/12.2604201

Fast and Robust Overlay Metrology from Visible to Infrared Wavelengths Using Dark-field Digital Holographic Microscopy

C. Messinis, T. T.M. Van Schaijk, N. Pandey, V. T. Tenner, A. Koolen, S. Witte, J. F. De Boer, A. J. Den Boef

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

Abstract

The aggressive reduction of semiconductor device dimensions drives many improvements in optical wafer metrology. Currently, chips with device feature sizes below 10 nm are in production which requires robust overlay metrology with sub-nm precision. We will present a compact dark-field Digital Holographic Microscope (df-DHM) that is able to measure overlay on small metrology targets from visible to infrared wavelengths. The coherent amplification and the aberration correction capabilities that is offered by df-DHM allow robust overlay metrology even on weak targets that are covered by absorbing layers. Measured data will be shown that demonstrate the capabilities of this metrology concept.

Original language	English
Title of host publication	Metrology, Inspection, and Process Control XXXVI
Editors	John C. Robinson, Matthew J. Sendelbach
Publisher	SPIE
Pages	90-100
Number of pages	11
Volume	12053
ISBN (Electronic)	9781510649811
DOIs	https://doi.org/10.1117/12.2604201
Publication status	Published - 2022
Event	Metrology, Inspection, and Process Control XXXVI 2022 - Virtual, Online Duration: 23 May 2022 → 27 May 2022

Publication series

Name	Proceedings of SPIE - The International Society for Optical Engineering
Volume	12053

Conference

Conference	Metrology, Inspection, and Process Control XXXVI 2022
City	Virtual, Online
Period	23/05/2022 → 27/05/2022

Keywords

Digital holographic microscopy
dark-field imaging
overlay metrology
semiconductor manufacturing

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

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https://doi.org/10.1117/12.2604201

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Messinis, C., Van Schaijk, T. T. M., Pandey, N., Tenner, V. T., Koolen, A., Witte, S., De Boer, J. F., & Den Boef, A. J. (2022). Fast and Robust Overlay Metrology from Visible to Infrared Wavelengths Using Dark-field Digital Holographic Microscopy. In J. C. Robinson, & M. J. Sendelbach (Eds.), Metrology, Inspection, and Process Control XXXVI (Vol. 12053, pp. 90-100). Article 120530B (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 12053). SPIE. https://doi.org/10.1117/12.2604201

Messinis, C. ; Van Schaijk, T. T.M. ; Pandey, N. et al. / Fast and Robust Overlay Metrology from Visible to Infrared Wavelengths Using Dark-field Digital Holographic Microscopy. Metrology, Inspection, and Process Control XXXVI. editor / John C. Robinson ; Matthew J. Sendelbach. Vol. 12053 SPIE, 2022. pp. 90-100 (Proceedings of SPIE - The International Society for Optical Engineering).

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title = "Fast and Robust Overlay Metrology from Visible to Infrared Wavelengths Using Dark-field Digital Holographic Microscopy",

abstract = "The aggressive reduction of semiconductor device dimensions drives many improvements in optical wafer metrology. Currently, chips with device feature sizes below 10 nm are in production which requires robust overlay metrology with sub-nm precision. We will present a compact dark-field Digital Holographic Microscope (df-DHM) that is able to measure overlay on small metrology targets from visible to infrared wavelengths. The coherent amplification and the aberration correction capabilities that is offered by df-DHM allow robust overlay metrology even on weak targets that are covered by absorbing layers. Measured data will be shown that demonstrate the capabilities of this metrology concept.",

keywords = "Digital holographic microscopy, dark-field imaging, overlay metrology, semiconductor manufacturing",

author = "C. Messinis and {Van Schaijk}, {T. T.M.} and N. Pandey and Tenner, {V. T.} and A. Koolen and S. Witte and {De Boer}, {J. F.} and {Den Boef}, {A. J.}",

year = "2022",

doi = "https://doi.org/10.1117/12.2604201",

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series = "Proceedings of SPIE - The International Society for Optical Engineering",

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Messinis, C, Van Schaijk, TTM, Pandey, N, Tenner, VT, Koolen, A, Witte, S, De Boer, JF & Den Boef, AJ 2022, Fast and Robust Overlay Metrology from Visible to Infrared Wavelengths Using Dark-field Digital Holographic Microscopy. in JC Robinson & MJ Sendelbach (eds), Metrology, Inspection, and Process Control XXXVI. vol. 12053, 120530B, Proceedings of SPIE - The International Society for Optical Engineering, vol. 12053, SPIE, pp. 90-100, Metrology, Inspection, and Process Control XXXVI 2022, Virtual, Online, 23/05/2022. https://doi.org/10.1117/12.2604201

Fast and Robust Overlay Metrology from Visible to Infrared Wavelengths Using Dark-field Digital Holographic Microscopy. / Messinis, C.; Van Schaijk, T. T.M.; Pandey, N. et al.
Metrology, Inspection, and Process Control XXXVI. ed. / John C. Robinson; Matthew J. Sendelbach. Vol. 12053 SPIE, 2022. p. 90-100 120530B (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 12053).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Academic › peer-review

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AU - Tenner, V. T.

AU - Koolen, A.

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AU - Den Boef, A. J.

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AB - The aggressive reduction of semiconductor device dimensions drives many improvements in optical wafer metrology. Currently, chips with device feature sizes below 10 nm are in production which requires robust overlay metrology with sub-nm precision. We will present a compact dark-field Digital Holographic Microscope (df-DHM) that is able to measure overlay on small metrology targets from visible to infrared wavelengths. The coherent amplification and the aberration correction capabilities that is offered by df-DHM allow robust overlay metrology even on weak targets that are covered by absorbing layers. Measured data will be shown that demonstrate the capabilities of this metrology concept.

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Messinis C, Van Schaijk TTM, Pandey N, Tenner VT, Koolen A, Witte S et al. Fast and Robust Overlay Metrology from Visible to Infrared Wavelengths Using Dark-field Digital Holographic Microscopy. In Robinson JC, Sendelbach MJ, editors, Metrology, Inspection, and Process Control XXXVI. Vol. 12053. SPIE. 2022. p. 90-100. 120530B. (Proceedings of SPIE - The International Society for Optical Engineering). Epub 2022 May 26. doi: https://doi.org/10.1117/12.2604201

Fast and Robust Overlay Metrology from Visible to Infrared Wavelengths Using Dark-field Digital Holographic Microscopy

Abstract

Publication series

Conference

Keywords

UN SDGs

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