TY - GEN
T1 - Non-isoplanatic lens aberration corrections in digital holographic microscopy
AU - Cromwijk, Tamar
AU - Adhikary, Manashee
AU - Konijnenberg, Sander
AU - Coene, Wim
AU - Tukker, Teus
AU - de Boer, Johannes
AU - Witte, Stefan
AU - den Boef, Arie
N1 - Publisher Copyright: © 2023 SPIE.
PY - 2023
Y1 - 2023
N2 - The demand for accurate and sub-nanometer precise overlay measurements in semiconductor industry increases with the shrinking feature sizes in integrated circuits. Overlay, the lateral displacement between two layers allows monitoring the chip fabrication process and is part of an import feedback step. In our approach, a digital holographic microscope measures the complex field of the overlay target using simple optics and an additional reference beam. The measured complex valued field allows us to apply computational algorithms to correct for field-position dependent lens aberrations in a computational efficient manner. We present experimental results that show the capability of our computational aberration correction in the visible and near infrared wavelength regimes.
AB - The demand for accurate and sub-nanometer precise overlay measurements in semiconductor industry increases with the shrinking feature sizes in integrated circuits. Overlay, the lateral displacement between two layers allows monitoring the chip fabrication process and is part of an import feedback step. In our approach, a digital holographic microscope measures the complex field of the overlay target using simple optics and an additional reference beam. The measured complex valued field allows us to apply computational algorithms to correct for field-position dependent lens aberrations in a computational efficient manner. We present experimental results that show the capability of our computational aberration correction in the visible and near infrared wavelength regimes.
KW - Semiconductor metrology
KW - computational imaging
KW - digital holographic microscopy
KW - lens aberrations correction
UR - http://www.scopus.com/inward/record.url?scp=85172710618&partnerID=8YFLogxK
U2 - https://doi.org/10.1117/12.2673637
DO - https://doi.org/10.1117/12.2673637
M3 - Conference contribution
VL - 12618
T3 - Proceedings of SPIE - The International Society for Optical Engineering
BT - Optical Measurement Systems for Industrial Inspection XIII
A2 - Lehmann, Peter
PB - SPIE
T2 - Optical Measurement Systems for Industrial Inspection XIII 2023
Y2 - 26 June 2023 through 29 June 2023
ER -